Parvus mensa laser Punching Apparatus 1000W-6000W minimum aperturae 0.1mm potest adhiberi ad metallum vitrum tellus materiae

Parvus Tabula laser Punching Apparatus 1000W-6000W minimum aperturae 0,1mm potest adhiberi ad metallum vitrum tellus materiae featured image

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Parvus mensa laser Punching apparatus est summus finem laser apparatu disposito denique processus. Continuat proficiebat laser technology et praecisione mechanica constructione ad consequi micron-gradu praecisione EXERCITATIO in parva workpieces. Cum suo pacto corpus consilio, efficient dispensando facultatem et intelligentes operationem interface, in apparatu occurrit necessitates moderni vestibulum industria in altum-praecisione et summus efficientiam dispensando.

Using a laser beam with high energy density as a processing tool, it can quickly and accurately penetrate various materials, including metals, plastics, ceramics, etc., and there is no contact and no thermal influence during the processing, ensuring the integrity and accuracy of the workpiece. In eodem tempore, in apparatu sustinet a varietate punching modos et processus modularis temperatio, users potest mollius set secundum actualem necessitates, ad consequi personalized processui.

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Applicabiles materiae

I. Metal Materials: ut aluminium, aeris, Titanium mixta, immaculatam ferro, etc.

2. Non-metallic materials: such as plastic (including polyethylene PE, polypropylene PP, polyester PET and other plastic films), glass (including ordinary glass, special glass such as ultra-white glass, K9 glass, high borosilicate glass, quartz glass, etc., but tempered glass due to its special physical properties are no longer suitable for drilling), ceramics, paper, leather and so on.

III. Composita materia: composito ex duobus vel materiae cum diversis proprietatibus per corporalis vel eget modi, cum optimum comprehensive proprietates.

4.Special Materials: in propria areas, laser Punching machinis potest etiam esse ad aliquid specialis materiae.

Specificationem parametri

Nomen	Notitia
Laser Power:	1000W-6000W
Cutting accurate:	± 0.03mm
Minimum-valorem aperturae:	0,1mm
Longitudo Conscidisti:	650mm × 800mm
PINIALIALIS CUPTATED:	≤ ± 0.008mm
Repetita accurate:	0.008mm
Cutting Gas:	Aera
Fixum Model:	Pneumaticae ore clamping, fixture firmamentum
Driving Ratio:	Magna Suspensio linearibus motricium
CIRCUMSPECTATIO	0.01mm-3mm

Technical commoda

1.Efficiente EXERCITATIO: usum summus industria laser trabem in non-contactus processus, ieiunium, I secundo ad perficere processus of minima foramina.

2.High praecisione: Per pressius imperans potentia, pulsus frequency et positus positus laser, quod EXERCITATIO operationem cum micronica praecisione potest fieri.

III. Late applicabiles: can processus a varietate fragilis, difficile ad processum et speciali materiae, ut plastic, Flexilis, metallum (Aliy, etc), speculum, talanium, et cetera), vitrum, et sic.

IV. Argutus operatio: Laser Punching apparatus instructa cum provectus numeralis imperium system, quod altus intelligentes et securus integrate cum computer adiutus celeri programming et ipsum complexu system ad animadverto rapido et processus.

Operantes condiciones

1.diversity, potest portare de varietate complexu figura foraminis processus, ut per foramina, quadratum foramina, triangulus foramina et alia specialis informibus foramina.

2.HIh Quality: quod est High Quality est summus, in ore gladii, non aspera affectum, et deformatio est parvum.

3.Automation: Potest perficere Micro-foraminis processus cum eodem aperturae magnitudine et uniformis distribution ad unum tempus et sustinet coetus foraminis processus sine manual interventu.

Apparatu features

■ parva magnitudinem apparatu, ut solvere quaestionem angustos spatium.

■ altum praecisione, maximum foraminis potest pervenire 0,005mm.

■ in apparatu facile agunt et securus utor.

■ de luce fontem potest reponi secundum diversas materiae et compatibility est fortior.

■ parva calor-affectata area, minus oxidatio circa foramina.

PRAEGRESSUS

I. Electronics Industry
● Typis circuitu tabula (PCB) Punching:

Microhole Machining: Used for Machining Microholes cum diameter minus quam 0,1mm in PCBs in occursum necessitatibus summus densitate internonnect (HDI) boards.
Caecus et pertusum foramina, machining caecus et buried foramina in multi-layer PCBs ad amplio perficientur et integration in tabula.

● Semiconductor packaging:
Lead frame EXERCITATIO: praecisione foramina sunt machined in semiconductor plumbum frame ad connectens chip ad externum circuitu.
Wafer cutting auxilium: ferrum foramina in laganum ad auxilium in subsequent secans et packaging processibus.

II. Precision Machinery
● Micro partes processui:
Precisione calces EXERCITATIO: Machining High-praecision foramina in Micro Gears pro praecisione tradenda systems.
Sensorem pars EXERCITATIO: Machining Microholes in sensorem components ut amplio sensitivity et responsio celeritas sensorem.

● FORMA vestibulum:
Format refrigerationem foraminis: Machining refrigerationem foraminis in iniectio fingunt aut mori mittere ad optimize calor dissipationem perficientur fingunt.
Vent dispensando: machining minima spiracula in fingunt ad redigendum formatam defectus.

III. Medical cogitationes
● minime Psidium chirurgicam instrumenta:
CATHETER perforation: Microholes sunt processionaliter in minime Psidium chirurgicam Catheters ad medicamento partus vel fluida INCILE.
Endoscope components: praecisione foramina sunt machined in lens vel instrumentum caput endoscope ad amplio functionality instrumenti.

● medicamento partus ratio:
Microoneedle Ordinata EXERCITATIO: Machining Microholes in a medicamento patch vel micronedle ordinata ad control medicamento release rate.
Bioochip EXERCITATIO: Microholes sunt processionaliter in biochips in cell culturae vel deprehendatur.

IV. Optical cogitationes
● Fiber opticus Iungo:
Optical fibra finem foraminis EXERCITATIO: Machining Microholes in finem faciem de optical iungo ut amplio optical signum transmissionem efficientiam.
Fibra ordinata machining: machining summus praecisione foramina in fibra ordinata laminam pro multi-channel optical communicationis.

● Optical Filter:
Filter EX EX EXERCITATIO: Machining Microholes in optical filter ad consequi lectio specifica wavelengths.
Machining diffractive elementum: Machining Microholes in diffractive optical elementa pro laser trabem scissionem vel effingere.

V. Automobile Vestibulum
● cibus iniectio ratio:
Iniectio Ceo Punching: Processing Micro-foramina in iniectio COLLUM ad optimize fuel atomization effectus et amplio combustione efficientiam.

● sensorem vestibulum:
Pressura sensorem EXERCITATIO: machining microholes in pressura sensorem diaphragm ad amplio sensitivity et accurate sensorem.

● Power altilium:
Poly polus Chip EXERCITATIO: Machining Microholes on Lithium Battery poli ad amplio electrolyte infiltration et ion onerariis.

Xkh offert a plena range of unus-subsisto servicia pro parva mensa laser perforators, comprehendo sed non limitatur ad: professional venditio consulting, customized progressio consilio, altus-qualitas Equipment, et Customers Service Service, accurate, et Customer Services, accurate, et Customer Service, accurate et Customers Service, accurate et Customers Service, accurate et Customers Service in Punching Processus.